Electroplating in a Submicron Trench

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CFD-ACE+ CFD

Summary

Electroplating is the primary means for depositing copper layers on to patterned dielectric for ultrascale integrated interconnect fabrication (ULSI). This tutorial gives a step-by-step procedure to setup and simulate the electroplating phenomenon in a submicron trench.

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Download2014_ace_tut_152_Electroplating.zip 5.9 MB