Electroplating in a Submicron Trench

To view the full version of this page (or to download files), please log in or create a new account



Electroplating is the primary means for depositing copper layers on to patterned dielectric for ultrascale integrated interconnect fabrication (ULSI). This tutorial gives a step-by-step procedure to setup and simulate the electroplating phenomenon in a submicron trench.

Download the file(s)

Download2014_ace_tut_152_Electroplating.zip 5.9 MB