Simulating Electroplating using CFD-ACE+

To view the full version of this page (or to download files), please log in or create a new account

by Abraham Meganathan on 23 Apr 2014
Electroplating is the oldest industrial application of electrochemical reactions where metals or alloys from metallic ions in electrolytes are deposited on a substrate. Plating enables engineers to tailor a deposit’s mechanical, electrical and magnetic properties and resistance to corrosion. Electroplating has significant applications in present day industry, ranging from microelectronics to metallurgy. Global competitive pressure has caused the microelectronic manufacturers to develop high yield cost effective devices using electrochemical processes. Electrochemical methods are used to create thin- and thick-film-patterned microstructure.