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IC.IDO 2024.1
IC.IDO 2024.1 : The Virtual Reality Solution for 3D Immersive Product and Process Experience. View more details about this release on IC.IDO 2024.1 Release Notes
VA One 2024.0 RC
The VA One 2024.0 RC release places key focus on additional improvements ... Highlights of this release: SEA Power Injection Modules will use VPS solver FEA Modeling GSP on FE Structure Rotational Results Import Export quadratic shell elements from pc file...
IC.IDO 2024.0
IC.IDO 2024.0 : The Virtual Reality Solution for 3D Immersive Product and Process Experience. View more details about this release on IC.IDO 2024.0 Release Notes
IC.IDO Weave 1.1
ESI IC.IDO Weave 1.1: Host Collaborative Virtual Workspaces for Human-Centric Process Validation workflows & immersive product integration.
IC.IDO 16.3
IC.IDO 16.3: The Virtual Reality Solution for 3D Immersive Product and Process Experience. View more details about this release on IC.IDO 16.3 Release Notes
FOAM-X 2023.0
ESI FOAM-X 2023.0 offers a range of upgraded and new functionality for characterizing acoustic materials from standard component testing See the FOAM-X 2023.0 Release Notes for more details.
NOVA 2023.0
ESI NOVA 2023.0 offers a range of upgraded and new functionalities, See the NOVA 2023.0 Release Notes for more details.
IC.IDO 16.2
IC.IDO 16.2: The Virtual Reality Solution for 3D Immersive Product and Process Experience. View more details about this release on IC.IDO 16.2 Release Notes
CEM One 2022.1
The CEM One 2022.1 is mainly a bugfix release. Several defects in recent and older functionality have been addressed: A new kind of impedance boundary condition, matrix IBC, which enables transmission, has been added. Several improvements to the performance and load balancing of the solver has been...
IC.IDO 16.1
IC.IDO 16.1: The Virtual Reality Solution for 3D Immersive Product and Process Experience. View more details about this release on IC.IDO 16.1 Release Notes
CEM One 2022.0
The CEM One 2022.0 release introduces mainly some CEM-TD related improvements such as: extrapolation procedure for low-frequency excitations solver support for sparse and lower-dimensional probes In addition, a number of other upgrades and corrections are included. More details can be found in the C...
IC.IDO 16.0
IC.IDO 16.0: The Virtual Reality Solution for 3D Immersive Product and Process Experience. View more details about this release on IC.IDO 16.0 Release Notes
NOVA 2022.0
ESI NOVA 2022.0 offers a range of upgraded and new functionalities, See the NOVA 2022.0 User's Guide for more details.
FOAM-X 2022.0
ESI FOAM-X 2022.0 offers a range of upgraded and new functionality for characterizing acoustic materials from standard component testing See the FOAM-X 2022.0 User's Guide for more details.
IC.IDO 15.1.1
IC.IDO 15.1.1: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 15.1.1 Release Notes
CEM One 2021.2
CEM One 2021.2 release focuses on EMC analysis with several new time-domain solver features, including models for thin slots, general dispersive materials, and conformal metallic surfaces. More details are found in the CEM One 2021.2 Documentation package.
IC.IDO 15.1
IC.IDO 15.1: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 15.1 Release Notes.
NOVA 2021.0
ESI NOVA 2021.0 offers a range of upgraded and new functionalities, See the NOVA 2021.0 Documentation Package and NOVA-FEM Documentation Package for more details.
CEM One 2021.1
With this 2021.1 release, several CEM-TD features have been extended, optimized or made complete, such as waveguide ports, multilayered paint coatings or thick material sheets (CEM-TD). For additional details about the release please see the CEM One 2021.1 Release Notes.See also Visual-Environment 1...