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IC.IDO 2024.1
IC.IDO 2024.1 : The Virtual Reality Solution for 3D Immersive Product and Process Experience. View more details about this release on IC.IDO 2024.1 Release Notes
PAM-STAMP 2024.0
PAM-STAMP 2024.0 provides the following new features on top of previous versions. Please have a look at PAM-STAMP Release Notes to get more info on the new capabilities.
VA One 2024.0 RC
The VA One 2024.0 RC release places key focus on additional improvements ... Highlights of this release: SEA Power Injection Modules will use VPS solver FEA Modeling GSP on FE Structure Rotational Results Import Export quadratic shell elements from pc file...
IC.IDO 2024.0
IC.IDO 2024.0 : The Virtual Reality Solution for 3D Immersive Product and Process Experience. View more details about this release on IC.IDO 2024.0 Release Notes
IC.IDO Weave 1.1
ESI IC.IDO Weave 1.1: Host Collaborative Virtual Workspaces for Human-Centric Process Validation workflows & immersive product integration.
IC.IDO 16.3
IC.IDO 16.3: The Virtual Reality Solution for 3D Immersive Product and Process Experience. View more details about this release on IC.IDO 16.3 Release Notes
PAM-STAMP 2023.0
PAM-STAMP 2023.0 provides the following new features on top of previous versions. Please have a look at PAM-STAMP and PAM-DIEMAKER for CATIA V5 Release Notes to get more info on the new capabilities. PAM-STAMP 2023.0.1 provides a bugfix for trimline opmization and compensation tha...
FOAM-X 2023.0
ESI FOAM-X 2023.0 offers a range of upgraded and new functionality for characterizing acoustic materials from standard component testing See the FOAM-X 2023.0 Release Notes for more details.
NOVA 2023.0
ESI NOVA 2023.0 offers a range of upgraded and new functionalities, See the NOVA 2023.0 Release Notes for more details.
IC.IDO 16.2
IC.IDO 16.2: The Virtual Reality Solution for 3D Immersive Product and Process Experience. View more details about this release on IC.IDO 16.2 Release Notes
PAM-STAMP 2022.1
PAM-STAMP 2022.1 brings several bug fixes on top of V2022.0. Please have a look at PAM-STAMP Release Notes to get more info on the new capabilities.
IC.IDO 16.1
IC.IDO 16.1: The Virtual Reality Solution for 3D Immersive Product and Process Experience. View more details about this release on IC.IDO 16.1 Release Notes
PAM-STAMP 2022.0
PAM-STAMP 2022.0 provides the following new features on top of previous versions . Please have a look at PAM-STAMP Release Notes (including BM-Stamp) and PAM-DIEMAKER for CATIA V5 Release Notes to get more info on the new capabilities.
IC.IDO 16.0
IC.IDO 16.0: The Virtual Reality Solution for 3D Immersive Product and Process Experience. View more details about this release on IC.IDO 16.0 Release Notes
NOVA 2022.0
ESI NOVA 2022.0 offers a range of upgraded and new functionalities, See the NOVA 2022.0 User's Guide for more details.
FOAM-X 2022.0
ESI FOAM-X 2022.0 offers a range of upgraded and new functionality for characterizing acoustic materials from standard component testing See the FOAM-X 2022.0 User's Guide for more details.
IC.IDO 15.1.1
IC.IDO 15.1.1: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 15.1.1 Release Notes
IC.IDO 15.1
IC.IDO 15.1: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 15.1 Release Notes.
PAM-STAMP 2021.0.1
PAM-STAMP 2021.0.1 is a pure GUI patch version bringing the following corrections over PAM-STAMP 2021.0 : Stability issues on 2D section cuts. Issue in springback locking conditions. Some software crash in Process Editor. Few issues on roll-hemming. Ability to define a negative value for distance fr...