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PAM-STAMP 2024.0
PAM-STAMP 2024.0 provides the following new features on top of previous versions. Please have a look at PAM-STAMP Release Notes to get more info on the new capabilities.
SYSWELD 2024.0
From Weld Quality to Body Manufacturing & Distortion Engineering, ESI SYSWELD offers a unique computer-aided assessment of material characteristics, residual stresses and distortions by taking into account all the multi-physics that is involved in Welding, Assembly and Heat Treatment manufacturi...
ProCAST 2024.0
ESI ProCAST 2024.0: an integrated software suite for the foundry industry to improve casting yield and quality. This version includes: ProCAST Solver 2024.0, QuikCAST Solver 2024.0, PAM-OPT 2024.0, Visual-Environment 2024.0, ESI-Player 7.0, Datalab 2023.5 Simulate t...
Virtual Performance Solution 2024.0
ESI Virtual Performance Solution is a unique solution allowing manufacturers to face emerging design challenges including those related to lightweight and green vehicles while avoiding over-engineering. It enables design and simulation engineers to test rapidly their innovations on virt...
SimulationX 2024
ESI’s SimulationX® 2024 expands its application range by introducing e.g. new heat exchanger models that significantly improve usability, performance and numerical stability. This is the start of a thorough rework that will continue into the next releases. The coverage for elect...
Visual-Environment 2024.0
ESI Visual-Environment 2024.0 is now available. A few Highlights of this version include: Support for VPS 2024.0 in Visual-Crash PAM. Also included are updates in Connection Manager and Dummy Integration Workflow apart from other updates. In Visual-Cast, support for Air Entr...
IC.IDO 2024.0
IC.IDO 2024.0 : The Virtual Reality Solution for 3D Immersive Product and Process Experience. View more details about this release on IC.IDO 2024.0 Release Notes
IC.IDO 15.1
IC.IDO 15.1: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 15.1 Release Notes.