Tips & Tricks

FD Interpolating Scheme near Metallic Structures

This article illustrates the PAM-CEM/FD interpolation scheme applied to compute the tangential electric field along wires’ path running near metallic structures (and aimed at avoiding the management of field components on both sides of the surface).

3D/Multiconductor Transmission Lines (MTL) Coupling VS. Stand-Alone FDTD (Accuracy)

This article is aimed at comparing the 3D/Multiconductor Transmission Lines (MTL) coupling accuracy with the PAM-CEM/FD stand-alone use, when applied to simplified wired models. Recommendations for good agreement are also proposed.

How to complete partial part on binder die design with “flat” part boundary?

In the following picture, the die entry radius in the addendum region should disappear smoothly in a flat surface (or infinite radius). In current version, there is no function to directly fulfill this need.