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IC.IDO 16.3
IC.IDO 16.3: The Virtual Reality Solution for 3D Immersive Product and Process Experience. View more details about this release on IC.IDO 16.3 Release Notes
CEM One 2022.1
The CEM One 2022.1 is mainly a bugfix release. Several defects in recent and older functionality have been addressed: A new kind of impedance boundary condition, matrix IBC, which enables transmission, has been added. Several improvements to the performance and load balancing of the solver has been...
PAM-STAMP 2022.1
PAM-STAMP 2022.1 brings several bug fixes on top of V2022.0. Please have a look at PAM-STAMP Release Notes to get more info on the new capabilities.
FOAM-X 2018
ESI FOAM-X 2018 offers a range of upgraded and new functionality. Please see the release notes for more details.
PAM-COMPOSITES 2018
ESI PAM-COMPOSITES: a unique Finite Element (FE) simulation chain for the modeling of the manufacturing process of composites structural components and thermoformed acoustic and cosmetic multi-material components, such as automotive interior parts. PAM-COMPOSITES 2018.0 is composed of following appl...