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CEM One 2022.1
The CEM One 2022.1 is mainly a bugfix release. Several defects in recent and older functionality have been addressed: A new kind of impedance boundary condition, matrix IBC, which enables transmission, has been added. Several improvements to the performance and load balancing of the solver has been...
PAM-STAMP 2022.1
PAM-STAMP 2022.1 brings several bug fixes on top of V2022.0. Please have a look at PAM-STAMP Release Notes to get more info on the new capabilities.
IC.IDO 12.0
IC.IDO 12.0: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 12.0 release notes
ACE+ Suite 2017.5 P1
ESI ACE+ Suite 2017.5 Patch 1 of Advanced CFD & Multiphysics software applications, enable coupled simulations of fluid, thermal, chemical, biological, electrical and mechanical phenomena. V2017.5 brings several new features and enhancements to existing features. Highlights of this Patch relea...
PAM-STAMP 2017.5.1
ESI PAM-STAMP 2017.5.1 fixes an important bug on assembly and flexforming related features. It is highly recommended to install it on top of V2017.5 (especially to run assembly and/or flexforming). ESI PAM-STAMP 2017.5.2 - PATCH (released on Dec 7, 2017) This patch fixes an important bug on compe...