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IC.IDO 2024.0
IC.IDO 2024.0 : The Virtual Reality Solution for 3D Immersive Product and Process Experience. View more details about this release on IC.IDO 2024.0 Release Notes

IC.IDO 16.3
IC.IDO 16.3: The Virtual Reality Solution for 3D Immersive Product and Process Experience. View more details about this release on IC.IDO 16.3 Release Notes

PAM-OPT 2023.0
ESI PAM-OPT 2023.0 has the following new main options: Adaptive RSM Algorithm:   Significant improvements have been made to the Adaptive RSM convergence.   When using the design parameter type 1 (discrete values), the CPU can be divided by two. Handling the Called Applicati...

IC.IDO 16.2
IC.IDO 16.2: The Virtual Reality Solution for 3D Immersive Product and Process Experience. View more details about this release on IC.IDO 16.2 Release Notes

IC.IDO 16.1
IC.IDO 16.1: The Virtual Reality Solution for 3D Immersive Product and Process Experience. View more details about this release on IC.IDO 16.1 Release Notes

IC.IDO 16.0
IC.IDO 16.0: The Virtual Reality Solution for 3D Immersive Product and Process Experience. View more details about this release on IC.IDO 16.0 Release Notes

PAM-OPT 2022.0
ESI PAM-OPT 2022.0 has the following new main options: Several Improvements of data retrievals, data treatments and data savings have been made: Long file names can be specified (256 characters.) Enhancement of the  syntax of string recognition (data retrievals.)  Save data from calls where an error...

IC.IDO 15.1.1
IC.IDO 15.1.1: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 15.1.1 Release Notes

IC.IDO 15.1
IC.IDO 15.1: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 15.1 Release Notes.

IC.IDO 15.0
IC.IDO 15.0: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 15.0 Release Notes.

PAM-OPT 2021.0
ESI PAM-OPT 2021.0 has the following new main options: Improvement of the algorithms: A new DOE option based on logarithms.   A new type of constraint applied to the optimizations of sequences. The new constraint is of the type "not equal to" applied to entities of two different sequences. Improveme...

IC.IDO 14.2
IC.IDO 14.2: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 14.2 Release Notes.

IC.IDO 14.1
IC.IDO 14.1: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 14.1 Release Notes.

IC.IDO 14.0
IC.IDO 14.0: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 14.0 Release Notes.

PAM-OPT 2020.5
ESI PAM-OPT 2020.5 has the following new main options: Improvement of the Adaptive RSM algorithm: Extension of the design parameter bounds. The design parameter bounds move when a bound prevents PAM-OPT from improving the solution. Relaxation of the constraint function bounds. Reserved for optimizat...

IC.IDO 13.2
IC.IDO 13.2: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 13.2 Release Notes.

PAM-OPT 2020.0
ESI PAM-OPT 2020 has the following new main options: Improvement of the algorithms: Adaptive RSM now allows the use of discrete design parameters. It is a major release that allows to converge much faster than standard algorithms. Improvement of curve treatments: A new option allows to calculate mat...

IC.IDO 13.1
IC.IDO 13.1: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 13.1 Release Notes.

PAM-OPT 2019.2
PAM-OPT 2019.2 for Renault and for special customers of the Casting solution.  

PAM-OPT 2019.1
ESI PAM-OPT 2019.1 has the following new main options: Improvement of the algorithms: LHS_DOE is a new algorithm. DISCRETE has more options. Improvement of the data treatments: Modifications of input curves. New types of curve calculations. Improvement of the saved data possibilities: Compression o...