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PAM-STAMP 2019.6
PAM-STAMP 2019.6 brings several bug fixes on top of V2019.5 in the fields of : Inverse solver (ability to run with pre-flattening). Locating with volume blanks. Drawbead manager (cases with pins having 0 restraining force + double bead). Glueing contact. Multi-OP compensation (trim die compensation)...
IC.IDO 13.1
IC.IDO 13.1: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 13.1 Release Notes.
PAM-STAMP 2019.5
PAM-STAMP 2019.5 brings several improvements especially for automotive line dies process definition and solver runs. Please read the Release Notes for the complete list of enhancements included in the version.
IC.IDO 13.0
IC.IDO 13.0: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 13.0 Release Notes.
PAM-STAMP 2019.0
PAM-STAMP 2019.0 release enables the user to be far more efficient with the setup and analysis of complete line die simulations, whether investigating a quick feasibility variant or an in-depth validation of the entire sheet metal forming process. Highlights of the release: Improved gas springs m...
IC.IDO 12.1
IC.IDO 12.1: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 12.1 release notes.
IC.IDO 12.0
IC.IDO 12.0: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 12.0 release notes
PAM-STAMP 2018.0.1
ESI PAM-STAMP 2018.0.1 fixes surface selection issues in tool editor, makes process editor fully compatible with compensation, and allows user to get a quick access to ESI-MatWizard from Windows start menu. View PAM-STAMP 2018.0 Release Notes for more details View PAM-STAMP 2018.0.1 Release Notes Ad...
PAM-STAMP 2018.0
PAM-STAMP 2018.0 release enables the user to be far more efficient with the setup and analysis of complete line die simulations, whether investigating a quick feasibility variant or an in-depth validation of the entire sheet metal forming process. Highlights of the release: Easily identify the best...
IC.IDO 11.2
IC.IDO 11.2: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 11.2 release notes
PAM-STAMP 2017.5.1
ESI PAM-STAMP 2017.5.1 fixes an important bug on assembly and flexforming related features. It is highly recommended to install it on top of V2017.5 (especially to run assembly and/or flexforming). ESI PAM-STAMP 2017.5.2 - PATCH (released on Dec 7, 2017) This patch fixes an important bug on compe...
PAM-STAMP 2017.5
ESI PAM-STAMP 2017.5 release continues with efficiency improvements for the setup and analysis of complete line die simulations. In particular the new gravity fit and the possibility to use very refined meshes with up to 10 million elements for large flexible blanks contribute to achieving a major g...
IC.IDO 11.1
IC.IDO 11.1: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 11.1 Release Notes
PAM-STAMP 2017.0
PAM-STAMP 2017.0 release enables the user to be far more efficient with the setup and analysis of complete line die simulations, whether investigating a quick feasibility variant or an in-depth validation of the entire sheet metal forming process. Highlights of the release: Revised graphical interfa...
IC.IDO 11.0
IC.IDO 11.0: The Virtual Reality Solution for 3D Immersive Product Experience. View more details about this release on IC.IDO 11.0 Release Notes
IC.IDO 10.2.1
IC.IDO: The Virtual Reality Solution for 3D Immersive Product Experience View more details about this release on IC.IDO 10.2.1 Release Notes
IC.IDO 10.2
IC.IDO 10.2: The Virtual Reality Solution for 3D Immersive Product Experience View more details about this release on IC.IDO 10.2 and IC.IDO Viewer 10.2 Release Notes
PAM-STAMP 2015.1
PAM-STAMP 2015.1: a complete solution from concept and styling to try-out and part production. Highlights of the new release: Piece cost estimation and nesting Complete solution for die face surfacing and validation, based on geometry, including CAD cleanup Friction work and plasticity as heat sourc...
IC.IDO 10.1.2
IC.IDO: The Virtual Reality Solution for 3D Immersive Product Experience